EVG semi-automatic double side mask aligner
The EVG®620 is a highly flexible R&D system that can handle small substrate pieces and wafers up to 4” substrate. The tool supports a variety of standard lithography processes, such as vacuum, soft, hard, and proximity exposure mode, as well as other specific applications, including top and back alignment. High throughput and yield is achieved with computer controlled contact force with substrate and mask. Mask Aligner is capable of printing up to 1um features with UV light source of wavelength 365nm.