Reactive Ion Etcher (RIE) – Oxford Instruments Plasma-Pro NGP80
PlasmaPro NGP80 ICP is a non-load-lock medium-density Reactive Ion Etching (RIE) system that uses fluorine chemistry to etch Silicon, Oxides, and Nitrides. The machine has both Inductively Coupled Plasma (ICP) enabling high process flexibility and anisotropic (Straight Vertical Wall) etching. The unit is equipped with Ar, N2, O2, SF6, CHF3, and CH4 gases.
OXFORD Plasma Pro NGP80 ICP